eMMC

Bild Artikelnummer Marke Beschreibung Menge Kaufen
KLM4G1FETE-B041

KLM4G1FETE-B041

Samsung Semiconductor

eMMC 5.1 4 GB 1.8, 3.3 V / 3.3 V HS400 11 x 10 x 0.8 mm -25 ~ 85 °C Mass Production

77410 pieces

KLM8G1GESD-B03P

KLM8G1GESD-B03P

Samsung Semiconductor

eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

114265 pieces

KLM8G1GESD-B03Q

KLM8G1GESD-B03Q

Samsung Semiconductor

eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

72000 pieces

KLM8G1GESD-B04P

KLM8G1GESD-B04P

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

78160 pieces

KLM8G1GESD-B04Q

KLM8G1GESD-B04Q

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

104520 pieces

KLM8G1GETF-B041

KLM8G1GETF-B041

Samsung Semiconductor

eMMC 5.1 8 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production

86620 pieces

KLM8G1GEUF-B04P

KLM8G1GEUF-B04P

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

114900 pieces

KLM8G1GEUF-B04Q

KLM8G1GEUF-B04Q

Samsung Semiconductor

eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

113140 pieces

KLMAG1JETD-B041

KLMAG1JETD-B041

Samsung Semiconductor

eMMC 5.1 16 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production

85120 pieces

KLMAG2GESD-B03P

KLMAG2GESD-B03P

Samsung Semiconductor

eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

81465 pieces

KLMAG2GESD-B03Q

KLMAG2GESD-B03Q

Samsung Semiconductor

eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

81770 pieces

KLMAG2GESD-B04P

KLMAG2GESD-B04P

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

94115 pieces

KLMAG2GESD-B04Q

KLMAG2GESD-B04Q

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

89385 pieces

KLMAG2GEUF-B04P

KLMAG2GEUF-B04P

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production

94325 pieces

KLMAG2GEUF-B04Q

KLMAG2GEUF-B04Q

Samsung Semiconductor

eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production

133175 pieces

KLMBG2JETD-B041

KLMBG2JETD-B041

Samsung Semiconductor

eMMC 5.1 32 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production

115810 pieces

KLMBG4GESD-B03P

KLMBG4GESD-B03P

Samsung Semiconductor

eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production

109230 pieces

KLMBG4GESD-B03Q

KLMBG4GESD-B03Q

Samsung Semiconductor

eMMC 5.0 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 105 °C Mass Production

128510 pieces

KLMBG4GESD-B04P

KLMBG4GESD-B04P

Samsung Semiconductor

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production

113305 pieces

KLMBG4GESD-B04Q

KLMBG4GESD-B04Q

Samsung Semiconductor

eMMC 5.1 32 GB 1.8 / 3.3 V HS400 11.5 x 13 x 1.0 mm -40 ~ 85 °C Mass Production

110800 pieces